Practicability of Surface Evolver in evolving prediction of SMT solder joint is reviewed and validated. Chapter five: finite element analysis method based on minimal energy principle with application of Surface Evolver is firstly used in evolving prediction of the kind of BGA solder joint shape.

基于最小能量原理的有限元數(shù)值分析方法與邊界值積分?jǐn)?shù)學(xué)分析方法相比com.91视频，能更有效地求解各類SMT焊點(diǎn)三維形態(tài)成形預(yù)測問題，并具有很好的熱應(yīng)力分析延續(xù)性和良好的分析精度。

The influence of the size of pad and solder bump, the volume of eutectic solder and reflow temperature on the geometry of duplex SnPb solder joint with high Pb solder bump and eutectic SnPb fillet was simulated by finite element method with the software of SURFACE EVOLVER.

應(yīng)用SurfaceEvolver軟件，對(duì)含高鉛焊料芯片凸點(diǎn)和共晶SnPb焊料形成的復(fù)合焊點(diǎn)的形態(tài)進(jìn)行了有限元模擬国内自拍AV在线，考察了焊盤大小91九色偷情自拍视频、芯片凸點(diǎn)尺寸黄色美女喷水在线观看视频、焊料體積、焊接溫度等焊點(diǎn)的設(shè)計(jì)及工藝參數(shù)對(duì)焊點(diǎn)形態(tài)的影響免费看污网站十八禁永久免费。

The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint.

摘 要：研究了電鍍Ni層和化學(xué)鍍Ni-P合金層對(duì)Sn-Ag/Cu焊點(diǎn)擴(kuò)散行為的影響国产丝袜美腿无码视频，電子探針分析表明：化學(xué)鍍Ni-P合金層能很好地阻止Sn-Ag/Cu焊點(diǎn)在焊接過程中的Cu，Sn互擴(kuò)散和相互反應(yīng)野花社区wwW日本最新免费观看；而電鍍Ni層則不能阻止Sn-Ag/Cu焊點(diǎn)在焊接過程中的Cu嘿咻嘿咻免费区在线观看不卡，Sn互擴(kuò)散和相互反應(yīng)，界面反應(yīng)產(chǎn)物仍以Cu6Sn5為主国产精品久久99囯产精品久久国。

coefficient of thermal expansion (CTE)：熱澎脹系數(shù)

coating error 防焊覆蓋錯(cuò)誤 | coefficient of thermal expansion (CTE) 熱澎脹系數(shù) | cold solder joint 冷焊點(diǎn)

soldered joint：焊接接頭; 點(diǎn)焊接合

solder-type head 易溶元件灑水噴頭 | soldered joint 焊接接頭; 點(diǎn)焊接合 | soldering iron 烙鐵

half-and-half joint：對(duì)拼接頭

half-and-half bearing ==> 半軸承 | half-and-half joint ==> 對(duì)拼接頭 | half-and-half solder ==> 錫鉛各半的焊料,鉛錫各半軟釬料